Products
XBW262-Fully Automatic Wafer Temporary Bonder

4”-8”wafer bonding application
Thinner wafer capability
Vacuum thermal press tape
Wafer cassette loading & unloading
Automatic device wafer & support wafer aligning
Automatic bonding tape laminating
Wafer intelligent mapping in cassette
Bonder wafer measuring post bonding (Optional)
PC based control with Windows OS
SECS/GEM or simple communication
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